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IEC 61249-2-6:2003 EN-FR
Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
现行
发布日期 :
1970-01-01
实施日期 :
IEC 61249-2-8:2003 EN-FR
Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
现行
发布日期 :
1970-01-01
实施日期 :
IEC 61249-2-9:2003 EN-FR
Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
现行
发布日期 :
1970-01-01
实施日期 :
IEC TR 62866:2014 EN-FR
Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
现行
发布日期 :
1970-01-01
实施日期 :
IEC TR 61189-5-506:2019 EN
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
现行
发布日期 :
1970-01-01
实施日期 :
IEC 62899-201:2016 EN
Printed electronics - Part 201: Materials - Substrates
现行
发布日期 :
1970-01-01
实施日期 :